A Low Loss Multi-Layer Dielectric Waveguide Filter for 60-GHz System-on-Package Applications

For V-band applications, this paper presents a fully embedded multi-layer dielectric waveguide filter (DWGF) with very low insertion loss and small size, which does not need any more assemblies such as flip-chip bonding and bond wires. The top and bottom plane are grounded, and therefore, although we make a metal housing, there will be no resonance occurrences. Especially, the proposed structure is very suitable for MMICs interconnection because the in/output pads consist of conductor backed co-planar waveguide (CBCPW). The filter is formed incorporating metallized through holes in low temperature co-fired ceramic (LTCC) substrates with relative dielectric constant of 7.05. The total volume of the filter including transitions is 4.5 mm × 2.65 mm × 0.4 mm. A fabricated DWGF with four transitions shows an insertion loss and a return loss of 2.95 dB and less than 15 dB at the center frequency of 62.17 GHz, respectively. According to the authors’ knowledge, the proposed filter shows the lowest insertion loss among the embedded multi-layer millimeter-wave filters ever reported for 60 GHz applications. key words: low temperature co-fired ceramic (LTCC), dielectric waveguide filter, system-on-package (SoP)